Communication Circuit Board

The communications network industry is evolving and changing, and it is critical for this fast-paced industry to meet its PCB needs without sacrificing quality requirements. NOD Electronics has the technical expertise to design and manufacture durable printed circuit boards for a variety of applications, providing a range of systems from design to production.

Laminate : CEM-1
Type : Carbon Ink
Layers : Double-sided
Application : Communication
Surface Finish : ENIG
Copper Thickness : 1oz
Laminate Thickness : 1.2mm

Communication Circuit Board

The communications network industry is evolving and changing, and it is critical for this fast-paced industry to meet its PCB needs without sacrificing quality requirements. NOD Electronics has the technical expertise to design and manufacture durable printed circuit boards for a variety of applications, providing a range of systems from design to production.

Our Capabilities of Circuit Board Manufacturing

Through HoleHDIFlexible PCB
Max. Layers20Min. Line Width/Space0.05/0.05mmMax. Plate Size2000*240mm
Max. Plate Thickness8.0mmKey Line/Tolerance0.065/15%Max. Layers10
Min. Plate Thickness0.4mmMin. Blind Hole Diameter0.10mmMin. Line Width/Space (1/4OZ)0.04mm
Max. thickness/Diameter Ratio14:01Blind Hole Loading Pad Size0.23mmMin. Line Width/Space (1/3OZ)0.05mm
Max. Copper Thickness4OZPTH & Blind Hole Size0.20mmMin. Line Width/Space (1/2OZ)0.055mm
Max. Plate Size2000x610mmPTH PAD Size0.35mmMin. Through Hole0.15mm
Min. Thickness of 4 Layers PCB0.33mmBlind Hole thickness/Diameter Ratio1:01Min. Hole Pad0.25mm
Min. Mechanical Hole/Pad0.15/0.35mmHDI Orders3+N+3Min. Laser Hole0.10mm
Drilling Precision+/-0.025mmMin. Thickness of 8 Layers PCB0.8mmMin. Laser Hole Pad0.25mm
PTH Hole Tolerance+/-0.03mmMin. Pad Side Window0.038mmCover Film Alignment Tolerance0.15mm
Min. Line Width/Space0.065/0.065mmMin. Ink Bridge0.065mmShape Tolerance0.05mm


Min. CSP/BGA Space/Min. Slot Width0.60mm


Impedance Tolerance±5%Pitch Tolerance±0.05mm




Rigid Flex (YES/NO)Yes




Air Gap (Yes/No)Yes
Surface Finish: ENIG/OSP/ HASL/ Au Plating (soft/hard)/ Immersion Ag/ Immersion Tin/ Bright Tin Plating/Ag Plating/ Carbon Ink

Miniaturization, multi-functional communication products is the development trend, leading to the requirements of the circuit produce is getting higher and higher, NOD Electronics has many years of electronic processing experience, we can meet  the licensing requirements and process requirements of your communications products, such as high-frequency PCB , High temperature PCB and high density PCB.


TAG:  Circuit Board PCB