CSP Packages Show 8% CAGR through 2020

2016-11-01 11:41:06 Viya 39

AUSTIN, TX – CSP packages, such as QFNs and stacked die CSPs, show an 8% CAGR from 2015 to 2020, according to TechSearch International, despite a slowing growth rate for smartphones.


Quad flat no-lead (QFN) packages are expected to have the strongest growth, with a CAGR of 8.6%. QFNs are found in a range of products, from automotive and industrial applications to mobile phones and wearable electronics.

Power devices continue to drive growth for copper clip versions of the QFN.

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