Communication PCB Fabrication and Assembly

NOD Electronics has the technical expertise to design and manufacture durable printed circuit boards for a variety of applications, providing a range of systems from design to production.

Laminate : FR-4
Type : Rigid
Layers : Double-sided
Application : Communication
Surface Finish : OSP
Copper Thickness : 0.5oz
Laminate Thickness : 1.0mm

The communications network industry is evolving and changing, and it is critical for this fast-paced industry to meet its PCB needs without sacrificing quality requirements. NOD Electronics has the technical expertise to PCB design and manufacture durable printed circuit boards for a variety of applications, providing a range of systems from design to production.

Our Capabilities of PCB Fabrication

Total Pad SizeStandardAdvanced
Capture PadDrill + 0.008Drill + 0.006
Landing PadDrill + 0.008Drill + 0.006
BC Mechanical Drill (Type III)0.0080.006
Laser Drill Size0.004-0.0100.0025
Material Thickness0.00350.0025
Stacked ViaYesYes
Type I Capabilities single & Double DeepYesYes
Type II Capabilities Buried Vias with MicroviasYesYes
Type III CapabilitiesYesYes
Copper Filled MicroviaYesYes
Smallest Copper Filled Microvia0.0040.0025
Copper Filled Microvia Aspect Ratio0.75:11:1
Smallest Laser Microvia Hole Size0.0040.0025
Laser Via Aspect Ratio (Depth:Diameter)0.75:11:1

Miniaturization, multi-functional communication products is the development trend, leading to the requirements of the circuit produce is getting higher and higher, NOD Electronics has many years of electronic processing experience, we can meet  the licensing requirements and process requirements of your communications products, such as high-frequency PCB , High temperature PCB and high density PCB.



Contact NOD Electronics Now!