Lead Free PCB Fabrication and Assembly

The lead-free PCB board is produced using a lead-free alloy consisting of 99.3% tin and 0.6% copper with a trace of nickel SN100CL. This lead free PCB material meets all legislation requirements for the European Union’s RoHS directive.

Laminate : FR-4
Type : Flexible
Layers : Double-sided
Application : Health Care
Surface Finish : OSP
Copper Thickness : 0.5oz
Laminate Thickness : 0.8mm

NOD Electronics is a leader in Printed Circuit Board solutions and is committed to taking an active role in working closely with our customers and suppliers to identify and rapidly eliminate hazardous substances from their products. As an ISO 9001:2000 registered company, NOD Electronics is fully supportive of electronics industry efforts throughout the world to phase out the use of lead and other undesirable elements.


The lead-free PCB board is produced using a lead-free alloy consisting of 99.3% tin and 0.6% copper with a trace of nickel SN100CL. This lead free PCB material meets all legislation requirements for the European Union’s RoHS directive.

Our Capabilities of PCB Fabrication

Total Pad SizeStandardAdvanced
Capture PadDrill + 0.008Drill + 0.006
Landing PadDrill + 0.008Drill + 0.006
BC Mechanical Drill (Type III)0.0080.006
Laser Drill Size0.004-0.0100.0025
Material Thickness0.00350.0025
Stacked ViaYesYes
Type I Capabilities single & Double DeepYesYes
Type II Capabilities Buried Vias with MicroviasYesYes
Type III CapabilitiesYesYes
Copper Filled MicroviaYesYes
Smallest Copper Filled Microvia0.0040.0025
Copper Filled Microvia Aspect Ratio0.75:11:1
Smallest Laser Microvia Hole Size0.0040.0025
Laser Via Aspect Ratio (Depth:Diameter)0.75:11:1

NOD Electronics is a leader in providing an extensive array of lead free PCB fabrication. NOD electronics 's lead free products are fully RoHS compliant.



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