Impedance-tested PCBS Manufacturing

NOD Electronics will provide you with straightforward, expert and active support in the implementation of your power application, to ensure that your requirements are met, both technically and economically.

Laminate : FR-4
Type : Rigid
Layers : Single Layer
Application : Others
Surface Finish : ENIG
Copper Thickness : heavy copper
Laminate Thickness : 1.6mm

Impedance-tested PCBS Manufacturing

Bare board testing involves using capacitance and resistance tests; Each of our machines uses a combination of both. Capacitance testing for a bare board involves testing for opens and shorts by "charging" a net or plane and then probing each net to measure the induced capacity.

Our Capabilities of Impedance-tested PCBS Manufacturing

Total Pad SizeStandardAdvanced
Capture PadDrill + 0.008Drill + 0.006
Landing PadDrill + 0.008Drill + 0.006
BC Mechanical Drill (Type III)0.0080.006
Laser Drill Size0.004-0.0100.0025
Material Thickness0.00350.0025
Stacked ViaYesYes
Type I Capabilities single & Double DeepYesYes
Type II Capabilities Buried Vias with MicroviasYesYes
Type III CapabilitiesYesYes
Copper Filled MicroviaYesYes
Smallest Copper Filled Microvia0.0040.0025
Copper Filled Microvia Aspect Ratio0.75:11:1
Smallest Laser Microvia Hole Size0.0040.0025
Laser Via Aspect Ratio (Depth:Diameter)0.75:11:1

Costs and Quotation of Impedance-tested PCBS Manufacturing

The total costs of impedance-tested PCB manufacturing and assembly services are mainly determined by PCB dimension, laminate thickness, surface finish, layer(s), other special technical requirements (such as blind & buried via, impedance), components, numbers of soldering pads and test plan. You can send PCB files (Gerbers) and BOM to get instant quotation within 24 hours.

NOD Electronics will provide you with straightforward, expert and active support in the implementation of your power application, to ensure that your requirements are met, both technically and economically.


TAG:   PCB Manufacturing PCB