BGA PCB Manufacturing

NOD Electronics has a vast amount of processing experiences in Ball Grid Array Assembly (BGA). Our facilities house the most current BGA placement equipment as well as X-ray inspection equipment.

Laminate : CEM-1
Type : Aluminum
Layers : Double-sided
Application : Others
Surface Finish : HASL
Copper Thickness : 1oz
Laminate Thickness : 1.0mm

BGA PCB Manufacturing

NOD Electronics has a vast amount of processing experiences in Ball Grid Array Assembly (BGA). Our facilities house the most current BGA placement equipment as well as X-ray inspection equipment. We have developed over the years BGA assembly processes with a proven record of producing BGA circuit boards with excellent yield rates and the highest quality in the electronics manufacturing industry.

We offer the entire gamut of manufacturing services for BGAs, including:

  • Ceramic BGA (CBGA)

  • Plastic BGA (PBGA)

  • Micro Fine Line BGA (MBGA)

  • Micro BGA

  • Stack BGAs

  • Leaded and Lead free BGAs

Our Capabilities of BGA PCB Manufacturing

Total Pad SizeStandardAdvanced
Capture PadDrill + 0.008Drill + 0.006
Landing PadDrill + 0.008Drill + 0.006
BC Mechanical Drill (Type III)0.0080.006
Laser Drill Size0.004-0.0100.0025
Material Thickness0.00350.0025
Stacked ViaYesYes
Type I Capabilities single & Double DeepYesYes
Type II Capabilities Buried Vias with MicroviasYesYes
Type III CapabilitiesYesYes
Copper Filled MicroviaYesYes
Smallest Copper Filled Microvia0.0040.0025
Copper Filled Microvia Aspect Ratio0.75:11:1
Smallest Laser Microvia Hole Size0.0040.0025
Laser Via Aspect Ratio (Depth:Diameter)0.75:11:1

Costs and Quotation of BGA PCB Manufacturing

The total costs of BGA PCB manufacturing and PCB assembly services are mainly determined by PCB dimension, laminate thickness, surface finish, layer(s), other special technical requirements (such as blind & buried via, impedance), components, numbers of soldering pads and test plan. You can send PCB files (Gerbers) and BOM to get instant quotation within 24 hours.

Apart from these, we can also provide rework and reballing services for BGAs that are already in use. Our rework and reballing capabilities include BGA removal and replacement, rework of ceramic and plastic BGAs and reballing of MBGAs. NOD Electronics becomes a one stop destination for all your BGA assembly services.



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