CEM-1 PCB Manufacturing

NOD Electronics has 10 years experience in CEM-1 circuit board manufacturing and continues to pursue breakthroughs. We have opened new plants and introduced new advanced processing equipment. We can do fast delivery, and strictly control the quality of production to ensure the reliability of production.

Laminate : CEM-1
Type : Rigid
Layers : Double-sided
Application : Communication
Surface Finish : OSP
Copper Thickness : 1oz
Laminate Thickness : 0.8mm

CEM-1 PCB Manufacturing

Composite epoxy materials (CEM) are a group of composite materials typically made from woven glass fabric surfaces and non-woven glass core combined with epoxy synthetic resin. They are typically used in printed circuit boards. CEM-1 is low-cost, flame-retardant, cellulose-paper-based laminate with only one layer of woven glass fabric.

Our Capabilities of PCB Manufacturing

Total Pad SizeStandardAdvanced
Capture PadDrill + 0.008Drill + 0.006
Landing PadDrill + 0.008Drill + 0.006
BC Mechanical Drill (Type III)0.0080.006
Laser Drill Size0.004-0.0100.0025
Material Thickness0.00350.0025
Stacked ViaYesYes
Type I Capabilities single & Double DeepYesYes
Type II Capabilities Buried Vias with MicroviasYesYes
Type III CapabilitiesYesYes
Copper Filled MicroviaYesYes
Smallest Copper Filled Microvia0.0040.0025
Copper Filled Microvia Aspect Ratio0.75:11:1
Smallest Laser Microvia Hole Size0.0040.0025
Laser Via Aspect Ratio (Depth:Diameter)0.75:11:1

NOD Electronics has 10 years experience in CEM-1 PCB manufacturing and continues to pursue breakthroughs. We have opened new plants and introduced new advanced processing equipment. We can do fast delivery, and strictly control the quality of production to ensure the reliability of production.


TAG:   PCB Manufacturing PCB