Communication PCB Manufacturing

Driven by our desire to increase efficiency and maintain product quality we are committed to continuing to invest in our manufacturing facilities to ensure that we remain a major force in the China electronics market.

Laminate : CEM-1
Type : Rigid
Layers : Double-sided
Application : Communication
Surface Finish : OSP
Copper Thickness : 0.5oz
Laminate Thickness : 1.0mm

Communication PCB Manufacturing

A customer in the network communications industry needed a company with the experience and resources to assemble their printed circuit board to exacting specifications. The communications network industry is evolving and changing, and it is critical for this fast-paced industry to meet its PCB needs without sacrificing quality requirements. NOD Electronics has the technical expertise to design and manufacture durable printed circuit boards for a variety of applications, providing a range of systems from design to production.

Our Capabilities of PCB Manufacturing

Total Pad SizeStandardAdvanced
Capture PadDrill + 0.008Drill + 0.006
Landing PadDrill + 0.008Drill + 0.006
BC Mechanical Drill (Type III)0.0080.006
Laser Drill Size0.004-0.0100.0025
Material Thickness0.00350.0025
Stacked ViaYesYes
Type I Capabilities single & Double DeepYesYes
Type II Capabilities Buried Vias with MicroviasYesYes
Type III CapabilitiesYesYes
Copper Filled MicroviaYesYes
Smallest Copper Filled Microvia0.0040.0025
Copper Filled Microvia Aspect Ratio0.75:11:1
Smallest Laser Microvia Hole Size0.0040.0025
Laser Via Aspect Ratio (Depth:Diameter)0.75:11:1

Driven by our desire to increase efficiency and maintain product quality we are committed to continuing to invest in our PCB manufacturing facilities to ensure that we remain a major force in the China electronics market.


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