Extreme Copper PCB Manufacturing

NOD Electronics has many years of experience producing extreme copper PCB and low-quantity production runs with short lead times for many different types of applications.

Laminate : CEM-3
Type : Rigid
Layers : 6 Layers
Application : Others
Surface Finish : OSP
Copper Thickness : heavy copper
Laminate Thickness : 1.2mm

Extreme Copper PCB Manufacturing

NOD Electronics has many years of experience producing extreme copper PCB and low-quantity production runs with short lead times for many different types of applications. Copper weights above 20 oz/ft2 and up to 200 oz/ft2 are also possible and are referred to as extreme copper.

Our Capabilities of Extreme Copper PCB Manufacturing

Total Pad SizeStandardAdvanced
Capture PadDrill + 0.008Drill + 0.006
Landing PadDrill + 0.008Drill + 0.006
BC Mechanical Drill (Type III)0.0080.006
Laser Drill Size0.004-0.0100.0025
Material Thickness0.00350.0025
Stacked ViaYesYes
Type I Capabilities single & Double DeepYesYes
Type II Capabilities Buried Vias with MicroviasYesYes
Type III CapabilitiesYesYes
Copper Filled MicroviaYesYes
Smallest Copper Filled Microvia0.0040.0025
Copper Filled Microvia Aspect Ratio0.75:11:1
Smallest Laser Microvia Hole Size0.0040.0025
Laser Via Aspect Ratio (Depth:Diameter)0.75:11:1

Costs and Quotation of Extreme Copper PCB Manufacturing

The total costs of extreme copper PCB manufacturing and PCB assembly services are mainly determined by PCB dimension, laminate thickness, surface finish, layer(s), other special technical requirements (such as blind & buried via, impedance), components, numbers of soldering pads and test plan. You can send PCB files (gerbers) and BOM to get instant quotation within 24 hours.

To fulfill your time-to-market is our mission during the course of extreme copper PCB manufacturing. We will make you stay without any hassle since you pass the manufacturing order to NOD Electronics. Value-added manufacturing services will impress you. PCBs with extreme copper assembly offers multiple advantages over a conventional printed circuit board, and is an ideal fit for today’s high-demand electronic applications.


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