FR4 PCB Manufacturing

FR4 (FR = Flame Retardent)is a glass fiber epoxy laminate. It is the most commonly used PCB material. 1.60 mm (0.062inch). FR4 uses 8 layers glass fiber material. The maximum ambient temperature is between 120o and 130oC, depending on thickness.

Laminate : FR-4
Type : Rigid-flex
Layers : Single Layer
Application : Health Care
Surface Finish : HASL
Copper Thickness : 1oz
Laminate Thickness : 1.2mm

FR4 PCB Manufacturing

Printed circuit boards, PCBs, can be made from a variety of substances. The most widely used in a form of glass fibre based board known as FR4. This provides a reasonable degree of stability under temperature variation and is does not breakdown badly, while not being excessively expensive.

Our Capabilities of PCB Manufacturing

Total Pad SizeStandardAdvanced
Capture PadDrill + 0.008Drill + 0.006
Landing PadDrill + 0.008Drill + 0.006
BC Mechanical Drill (Type III)0.0080.006
Laser Drill Size0.004-0.0100.0025
Material Thickness0.00350.0025
Stacked ViaYesYes
Type I Capabilities single & Double DeepYesYes
Type II Capabilities Buried Vias with MicroviasYesYes
Type III CapabilitiesYesYes
Copper Filled MicroviaYesYes
Smallest Copper Filled Microvia0.0040.0025
Copper Filled Microvia Aspect Ratio0.75:11:1
Smallest Laser Microvia Hole Size0.0040.0025
Laser Via Aspect Ratio (Depth:Diameter)0.75:11:1

FR4 (FR = Flame Retardent)is a glass fiber epoxy laminate. It is the most commonly used PCB material. 1.60 mm (0.062inch). FR4 uses 8 layers glass fiber material. The maximum ambient temperature is between 120o and 130oC, depending on thickness.

NOD Electronics has 10 years experiences in FR4 circuit board manufacturing and continues to pursue breakthroughs. We have opened new plants and introduced new advanced processing equipment. We can do fast delivery, and strictly control the quality of production to ensure the reliability of production.



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