HASL PCB Manufacturing

HASL stands for Hot Air Solder Leveling. The circuit boards must be immersed in a tin/lead alloy for this finish. ‘Air knives’ then remove the excess solder by blowing hot air across the surface of the board.

Laminate : CEM-3
Type : Rigid
Layers : Double-sided
Application : Communication
Surface Finish : HASL
Copper Thickness : 0.5oz
Laminate Thickness : 0.8mm

HASL PCB Manufacturing

NOD Electronics has lead the PCB industry for over 25 years, providing some of the most innovative printed circuit board technologies and highest quality standards found in the industry today.  You can count on us to cater to your specific needs, from the simplest boards to the most complex designs for small quantity and large scale production.

HASL stands for Hot Air Solder Leveling. The circuit boards must be immersed in a tin/lead alloy for this finish. ‘Air knives’ then remove the excess solder by blowing hot air across the surface of the board.

Our Capabilities of PCB Manufacturing

Total Pad SizeStandardAdvanced
Capture PadDrill + 0.008Drill + 0.006
Landing PadDrill + 0.008Drill + 0.006
BC Mechanical Drill (Type III)0.0080.006
Laser Drill Size0.004-0.0100.0025
Material Thickness0.00350.0025
Stacked ViaYesYes
Type I Capabilities single & Double DeepYesYes
Type II Capabilities Buried Vias with MicroviasYesYes
Type III CapabilitiesYesYes
Copper Filled MicroviaYesYes
Smallest Copper Filled Microvia0.0040.0025
Copper Filled Microvia Aspect Ratio0.75:11:1
Smallest Laser Microvia Hole Size0.0040.0025
Laser Via Aspect Ratio (Depth:Diameter)0.75:11:1

NOD Electronics is a leader in PCB manufacturing and is committed to taking an active role in working closely with our customers and suppliers to identify and rapidly eliminate hazardous substances from their products. As an ISO 9001:2000 registered company, NOD Electronics is fully supportive of electronics industry efforts throughout the world to phase out the use of lead and other undesirable elements.



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