Lead Free PCB Manufacturing

The lead-free PCB board is produced using a lead-free alloy consisting of 99.3% tin and 0.6% copper with a trace of nickel SN100CL. This lead free PCB material meets all legislation requirements for the European Union’s RoHS directive. Electronic Interconnect manufactures LEAD FREE circuit boards using customer specified RoHS compliant materials.

Laminate : CEM-1
Type : Rigid-flex
Layers : Single Layer
Application : Military
Surface Finish : OSP
Copper Thickness : 0.5oz
Laminate Thickness : 1.0mm

Lead Free PCB Manufacturing

The lead-free PCB board is produced using a lead-free alloy consisting of 99.3% tin and 0.6% copper with a trace of nickel SN100CL. This lead free PCB material meets all legislation requirements for the European Union’s RoHS directive. Electronic Interconnect manufactures LEAD FREE circuit boards using customer specified RoHS compliant materials.

Our Capabilities of PCB Manufacturing

Total Pad SizeStandardAdvanced
Capture PadDrill + 0.008Drill + 0.006
Landing PadDrill + 0.008Drill + 0.006
BC Mechanical Drill (Type III)0.0080.006
Laser Drill Size0.004-0.0100.0025
Material Thickness0.00350.0025
Stacked ViaYesYes
Type I Capabilities single & Double DeepYesYes
Type II Capabilities Buried Vias with MicroviasYesYes
Type III CapabilitiesYesYes
Copper Filled MicroviaYesYes
Smallest Copper Filled Microvia0.0040.0025
Copper Filled Microvia Aspect Ratio0.75:11:1
Smallest Laser Microvia Hole Size0.0040.0025
Laser Via Aspect Ratio (Depth:Diameter)0.75:11:1

NOD Electronics is a leader in PCB manufacturing and is committed to taking an active role in working closely with our customers and suppliers to identify and rapidly eliminate hazardous substances from their products. As an ISO 9001:2000 registered company, NOD Electronics is fully supportive of electronics industry efforts throughout the world to phase out the use of lead and other undesirable elements.



TAG:   PCB Manufacturing PCB