Multilayer PCB Manufacturing

NOD Electronics has 10 years experiences in multilayer circuit board manufacturing and continues to pursue breakthroughs. We have opened new plants and introduced new advanced processing equipment. We can do fast delivery, and strictly control the quality of production to ensure the reliability of production.

Laminate : CEM-1
Type : Aluminum
Layers : 12 Layers
Application : Military
Surface Finish : OSP
Copper Thickness : 0.5oz
Laminate Thickness : 0.8mm

Multilayer PCB Manufacturing

NOD Electronics specializing in producing single, double, four to ten layer PCB and multilayer. The company has the grearest PCB production equipment, and equipped with high-precision testing equipment and laboratories. We can produce all kinds of high-precision, high-density circuit board 850,000 square feet monthly, the smallest aperture up to Φ0.1mm, the minimum line width 3mil, the minimum line distance 3mil. We also can offer one-stop service which based on customer PCB schematic design.

Our Capabilities of PCB Manufacturing

Total Pad SizeStandardAdvanced
Capture PadDrill + 0.008Drill + 0.006
Landing PadDrill + 0.008Drill + 0.006
BC Mechanical Drill (Type III)0.0080.006
Laser Drill Size0.004-0.0100.0025
Material Thickness0.00350.0025
Stacked ViaYesYes
Type I Capabilities single & Double DeepYesYes
Type II Capabilities Buried Vias with MicroviasYesYes
Type III CapabilitiesYesYes
Copper Filled MicroviaYesYes
Smallest Copper Filled Microvia0.0040.0025
Copper Filled Microvia Aspect Ratio0.75:11:1
Smallest Laser Microvia Hole Size0.0040.0025
Laser Via Aspect Ratio (Depth:Diameter)0.75:11:1

NOD Electronics has 10 years experiences in multilayer PCB manufacturing and continues to pursue breakthroughs. We have opened new plants and introduced new advanced processing equipment. We can do fast delivery, and strictly control the quality of production to ensure the reliability of production.


TAG:   PCB Manufacturing PCB