OSP PCB Manufacturing

As a service-leading PCB manufacturing and PCB assembly (PCBA) partner, NOD Electronics strives to support international small-medium business with 10+ years engineering experience in Electronic Manufacturing Services (EMS). Our turnkey or consigned PCB assembly service meets IPC Class 3 standards and is ISO 9001:2008-certified, RoHS compliant .

Laminate : CEM-1
Type : Rigid
Layers : 4 Layers
Application : Communication
Surface Finish : OSP
Copper Thickness : 1oz
Laminate Thickness : 1.2mm

OSP PCB Manufacturing

Organic Solder Preservative, commonly referred to as OSP Finish, is the leader in low cost surface finishes. It is designed to produce a thin, uniform, protective layer on the copper surface of the PCB that shields the circuitry from oxidization during storage and assembly operations. While OSP Finish has been around for quite some time, it has only recently gained popularity as customers increase their search for Lead-free and fine pitch options.

Our Capabilities of PCB Manufacturing

Total Pad SizeStandardAdvanced
Capture PadDrill + 0.008Drill + 0.006
Landing PadDrill + 0.008Drill + 0.006
BC Mechanical Drill (Type III)0.0080.006
Laser Drill Size0.004-0.0100.0025
Material Thickness0.00350.0025
Stacked ViaYesYes
Type I Capabilities single & Double DeepYesYes
Type II Capabilities Buried Vias with MicroviasYesYes
Type III CapabilitiesYesYes
Copper Filled MicroviaYesYes
Smallest Copper Filled Microvia0.0040.0025
Copper Filled Microvia Aspect Ratio0.75:11:1
Smallest Laser Microvia Hole Size0.0040.0025
Laser Via Aspect Ratio (Depth:Diameter)0.75:11:1

As a service-leading PCB manufacturing and PCB assembly (PCBA) partner, NOD Electronics strives to support international small-medium business with 10+ years engineering experience in Electronic Manufacturing Services (EMS). Our turnkey or consigned PCB assembly service meets IPC Class 3 standards and is ISO 9001:2008-certified, RoHS compliant .


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