Single layer PCB Manufacturing

Single sided PCB diagram mainly use network printing (Screen Printing) .That is to print resist on the bare copper, etch and then print solder mask, finally punching to finish parts plated hole and profile. In addition, some small amount of various products usually use photoresist to pattern circuit.

Laminate : CEM-1
Type : Rigid
Layers : Single Layer
Application : Military
Surface Finish : HASL
Copper Thickness : 1oz
Laminate Thickness : 1.0mm

Single layer PCB Manufacturing

Single sided PCB diagram mainly use network printing (Screen Printing) .That is to print resist on the bare copper, etch and then print solder mask, finally punching to finish parts plated hole and profile. In addition, some small amount of various products usually use photoresist to pattern circuit.

Our Capabilities of PCB Manufacturing

Total Pad SizeStandardAdvanced
Capture PadDrill + 0.008Drill + 0.006
Landing PadDrill + 0.008Drill + 0.006
BC Mechanical Drill (Type III)0.0080.006
Laser Drill Size0.004-0.0100.0025
Material Thickness0.00350.0025
Stacked ViaYesYes
Type I Capabilities single & Double DeepYesYes
Type II Capabilities Buried Vias with MicroviasYesYes
Type III CapabilitiesYesYes
Copper Filled MicroviaYesYes
Smallest Copper Filled Microvia0.0040.0025
Copper Filled Microvia Aspect Ratio0.75:11:1
Smallest Laser Microvia Hole Size0.0040.0025
Laser Via Aspect Ratio (Depth:Diameter)0.75:11:1

NOD Electronics has 10 years experience in single layer circuit board manufacturing and continues to pursue breakthroughs. We have opened new plants and introduced new advanced processing equipment. We can do fast delivery, and strictly control the quality of production to ensure the reliability of production.



TAG:   PCB Manufacturing PCB