Application-specific PCBS PCB Assembly

NOD Electronics' application-specific PCBS assembly offers a full turnkey electronic manufacturing operation, including assemblies, modules, systems complete with testing and coating capabilities, in a domestic facility.​

Laminate : FR-4
Layers : Double-sided
Laminate Thickness : 0.8mm
Copper Thickness : 1.5oz
Surface Finish : ENIG
Assembly : SMT & DIP
Test : Function Test
Package : Foam
Standards : IPC-A-610E
Lead Free : RoHS
Min. Chips : 0402

Application-specific PCBS PCB Assembly

NOD Electronics' application-specific PCBS assembly offers a full turnkey electronic manufacturing operation, including assemblies, modules, systems complete with testing and coating capabilities, in a domestic facility.

Application-specific PCBS PCB Assembly Capabilities

7 SMT linesUp to 12 layersFuji & Samsung SMT mounters
4 DIP linesSMT/DIPAuto solder paste screen printer
0201 componentIn circuit testReflow ovens with 10 zones
0.25mm BGAFunction circuit testAuto optical inspection
Laser stencilsBurn in testWave soldering (lead-free)
Senju solder pasteBox BuildingX-ray

Application-specific PCBS PCB Assembly Process Control

NOD Electronics fully show respect to your strict confidentiality of documentation and procedures and has formalized a range of control process that can ensure customer products in delivery of good quality. We will operate the process during Incoming Quality Control (IQC), In-Process Quality Control (IPQC), Outgoing Quality Assurance (OQA) etc stages and management methods ISO, 7 sigma, PDCA.

pcb assembly process control

We hold numerous industry certifications and are uniquely experienced meeting the requirements of many demanding military and aerospace standards. Our commitment to quality ensured that this component met all tolerance requirements as well as DOD-STD-1686, Class 2 standard for electrical discharge and MIL-STD-2000 for soldered electrical assemblies.


Contact NOD Electronics Now!


TAG:  PCB assembly