Blind Via PCB Assembly

Blind via connects one external layer and one or more inner layers in printed circuit board, responsible for interconnection between top layer and inner layers or bottom layer and inner layers.

Laminate : CEM-3
Layers : 4
Laminate Thickness : 1.0mm
Copper Thickness : 0.5oz
Surface Finish : HASL
Assembly : SMT
Test : Programming
Package : Carton
Standards : TS16949
Lead Free : RoHS
Min. Chips : 0402

Blind Via PCB Assembly

Vias, that is, copper plated holes, play a key role in the interconnection between layers in a printed circuit board. Generally speaking, vias in PCBs can be classified into the following categories: through-hole via, blind via and buried via. Blind/buried vias are widely applied in SMT (Surface Mount Technology) just to compensate for disadvantages of through-hole vias.

Blind via connects one external layer and one or more inner layers in printed circuit board, responsible for interconnection between top layer and inner layers or bottom layer and inner layers.

Blind Via PCB Assembly Capabilities

7 SMT linesUp to 12 layersFuji & Samsung SMT mounters
4 DIP linesSMT/DIPAuto solder paste screen printer
0201 componentIn circuit testReflow ovens with 10 zones
0.25mm BGAFunction circuit testAuto optical inspection
Laser stencilsBurn in testWave soldering (lead-free)
Senju solder pasteBox BuildingX-ray

Blind Via PCB Assembly Process Control

NOD Electronics fully show respect to your strict confidentiality of documentation and procedures and has formalized a range of control process that can ensure customer products in delivery of good quality. We will operate the process during Incoming Quality Control (IQC), In-Process Quality Control (IPQC), Outgoing Quality Assurance (OQA) etc stages and management methods ISO, 7 sigma, PDCA.

pcb assembly process control

Due to our over 10 years' experience in this industry, NOD Electronics specializes in manufacturing PCBs with blind/buried Vias. Both engineers and manufacturing equipment from NOD Electronics ensure our full capabilities in meeting the requirements of blind/buried via technology.

Up to now, we're capable of providing mechanically drilled and laser drilled solutions. When it comes to mechanical drilling, via diameter ranges from 0.2mm to 0.4mm while 0.1mm for laser drilling.



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TAG:  PCB assembly