CEM-1 PCB Assembly

Composite epoxy materials (CEM) are a group of composite materials typically made from woven glass fabric surfaces and non-woven glass core combined with epoxy synthetic resin. They are typically used in printed circuit boards. CEM-1 is low-cost, flame-retardant, cellulose-paper-based laminate with only one layer of woven glass fabric.

Laminate : CEM-1
Layers : Double-sided
Laminate Thickness : 1.0mm
Copper Thickness : 0.5oz
Surface Finish : OSP
Assembly : SMT & DIP
Test : Function Test
Package : Carton
Standards : ISO9001:2008
Lead Free : Lead
Min. Chips : 01005

CEM-1 PCB Assembly

Regarding your CEM-1 PCB assembly demand, we have big capabilities for SMT/SMD assembly, through-hole and mixed technology PCB assemblies. BGA down to 0.25mm pitch, 0201 component placements and leadless devices assembly can also be available. High speed advanced Fuji SMT machines can well support your strict requirements of PCB assembly, whatever in relation to mil-spec, network, communication, health care, medical, musical instrument application. In terms of pass rate, we have done 99.9%. Our experienced and responsive engineering team will discuss about assembly manufacturing process once we get your order. The best work plan will be figured out and your PCBs are performed in quality online.

CEM-1 PCB Assembly Capabilities

NOD Electronics have 7 advance SMT lines, 4 box building and through hole lines, screen printer, reflow oven, wave soldering, cleaning system, x-Ray, BGA rework station, AOI and cleaning system. We can support any batch order volume (medium to small). More importantly, we have plenty experiences of offering PCB assembly samples. Economic and quick plans are waiting for your reviewing, because we really take your lead time and stands at initial stage of the projects. So in generally you can get PCB assembly boards in 15 days (including time of PCB manufacturing, components purchase, PCB assembly and test).

7 SMT linesUp to 12 layersFuji & Samsung SMT mounters
4 DIP linesSMT/DIPAuto solder paste screen printer
0201 componentIn circuit testReflow ovens with 10 zones
0.25mm BGAFunction circuit testAuto optical inspection
Laser stencilsBurn in testWave soldering (lead-free)
Senju solder pasteBox BuildingX-ray

CEM-1 PCB Assembly Process Control

NOD Electronics fully show respect to your strict confidentiality of documentation and procedures and has formalized a range of control process that can ensure customer products in delivery of good quality. We will operate the process during Incoming Quality Control (IQC), In-Process Quality Control (IPQC), Outgoing Quality Assurance (OQA) etc stages and management methods ISO, 7 sigma, PDCA.

pcb assembly process control


Composite epoxy materials (CEM) are a group of composite materials typically made from woven glass fabric surfaces and non-woven glass core combined with epoxy synthetic resin. They are typically used in printed circuit boards. CEM-1 is low-cost, flame-retardant, cellulose-paper-based laminate with only one layer of woven glass fabric.




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TAG:  PCB