Conductive Carbon Ink PCB Assembly

NOD Electronics offers superior conductive inks and conductive coatings to address a wide variety of applications in the energy, consumer electronics and utilities industries.

Laminate : FR-4
Layers : Double-sided
Laminate Thickness : 1.2mm
Copper Thickness : 1.0oz
Surface Finish : HASL
Assembly : SMT & DIP
Test : Function Test
Package : Vacuum
Standards : TS16949
Lead Free : Lead
Min. Chips : 0201

Conductive Carbon Ink PCB Assembly

NOD Electronics' product range of conductive, dielectric and other functional polymer thick film inks have been used to apply selective coatings on a variety of flexible and rigid substrates, via screen, flexographic and rotogravure printing methods.

Conductive Carbon Ink PCB Assembly Capabilities

7 SMT linesUp to 12 layersFuji & Samsung SMT mounters
4 DIP linesSMT/DIPAuto solder paste screen printer
0201 componentIn circuit testReflow ovens with 10 zones
0.25mm BGAFunction circuit testAuto optical inspection
Laser stencilsBurn in testWave soldering (lead-free)
Senju solder pasteBox BuildingX-ray

Conductive Carbon Ink PCB Assembly Process Control

NOD Electronics fully show respect to your strict confidentiality of documentation and procedures and has formalized a range of control process that can ensure customer products in delivery of good quality. We will operate the process during Incoming Quality Control (IQC), In-Process Quality Control (IPQC), Outgoing Quality Assurance (OQA) etc stages and management methods ISO, 7 sigma, PDCA.

pcb assembly process control

At NOD Electronics we pride ourselves on having flexible approach to manufacturing listening to our clients and being responsive to them. Couple this with the investment we have made to bring in state of the art machinery to assemble the latest components. We can offer an PCBA assembly service from prototype batches to high-volume production.


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TAG:  PCB assembly