High Performance PCB Assembly

NOD Electronics has the global technology, facilities and supply chains necessary to ensure rapid quoting and prototyping, as well as, a seamless and expedited transition to a high-volume manufacturing environment.

Laminate : CEM-1
Layers : Double-sided
Laminate Thickness : 0.8mm
Copper Thickness : 1.0oz
Surface Finish : HASL
Assembly : SMT & DIP
Test : Function Test
Package : Vacuum
Standards : IPC-A-610E
Lead Free : RoHS
Min. Chips : 0201

High Performance PCB Assembly

NOD Electronics use a mixture of automation and highly skilled manual assembly techniques. Naked die and packaged components can be assembled on the same substrate giving very high performance boards.

High Performance PCB Assembly Capabilities

7 SMT linesUp to 12 layersFuji & Samsung SMT mounters
4 DIP linesSMT/DIPAuto solder paste screen printer
0201 componentIn circuit testReflow ovens with 10 zones
0.25mm BGAFunction circuit testAuto optical inspection
Laser stencilsBurn in testWave soldering (lead-free)
Senju solder pasteBox BuildingX-ray

High Performance PCB Assembly Process Control

NOD Electronics fully show respect to your strict confidentiality of documentation and procedures and has formalized a range of control process that can ensure customer products in delivery of good quality. We will operate the process during Incoming Quality Control (IQC), In-Process Quality Control (IPQC), Outgoing Quality Assurance (OQA) etc stages and management methods ISO, 7 sigma, PDCA.

pcb assembly process control

NOD Electronics has the global technology, facilities and supply chains necessary to ensure rapid quoting and prototyping, as well as, a seamless and expedited transition to a high-volume PCB manufacturing environment. NOD Electronics offers real-time collaboration, end-to-end project tracking and management, consistent quality control across facilities and the shortest time-to-market possible.


Contact NOD Electronics Now!


TAG:  PCB assembly