Impedance-tested PCBS PCB Assembly

Bare board testing involves using capacitance and resistance tests; Each of our machines uses a combination of both.

Laminate : CEM-3
Layers : Double-sided
Laminate Thickness : 1.0mm
Copper Thickness : 1.0oz
Surface Finish : HASL
Assembly : SMT & DIP
Test : Function Test
Package : Carton
Standards : IPC-A-610E
Lead Free : RoHS
Min. Chips : 01005

Impedance-tested PCBS PCB Assembly

Bare board testing involves using capacitance and resistance tests; Each of our machines uses a combination of both. Capacitance testing for a bare board involves testing for opens and shorts by "charging" a net or plane and then probing each net to measure the induced capacity.

Impedance-tested PCBS PCB Assembly Capabilities

7 SMT linesUp to 12 layersFuji & Samsung SMT mounters
4 DIP linesSMT/DIPAuto solder paste screen printer
0201 componentIn circuit testReflow ovens with 10 zones
0.25mm BGAFunction circuit testAuto optical inspection
Laser stencilsBurn in testWave soldering (lead-free)
Senju solder pasteBox BuildingX-ray

Impedance-tested PCBS PCB Assembly Process Control

NOD Electronics fully show respect to your strict confidentiality of documentation and procedures and has formalized a range of control process that can ensure customer products in delivery of good quality. We will operate the process during Incoming Quality Control (IQC), In-Process Quality Control (IPQC), Outgoing Quality Assurance (OQA) etc stages and management methods ISO, 7 sigma, PDCA.

pcb assembly process control

Our team will provide you with straightforward, expert and active support in the implementation of your power application, to ensure that your requirements are met, both technically and economically.



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TAG:  PCB assembly