Mil Grade PCB Assembly

NOD Electronics provides complete turnkey, printed circuit board (PCBA) assembly solutions for products and assemblies used in military grade applications.

Laminate : CEM-3
Layers : Double-sided
Laminate Thickness : 1.0mm
Copper Thickness : 1.0oz
Surface Finish : OSP
Assembly : SMT & DIP
Test : Function Test
Package : Foam
Standards : IPC-A-610E
Lead Free : RoHS
Min. Chips : 0201

Mil Grade PCB Assembly

NOD Electronics provides complete turnkey, printed circuit board (PCBA) assembly solutions for products and assemblies used in military grade applications. Our solutions include electronic prototype manufacturing as well as small, mid and full-level production that can include complete purchasing and fulfillment services.

Mil Grade PCB Assembly Capabilities

7 SMT linesUp to 12 layersFuji & Samsung SMT mounters
4 DIP linesSMT/DIPAuto solder paste screen printer
0201 componentIn circuit testReflow ovens with 10 zones
0.25mm BGAFunction circuit testAuto optical inspection
Laser stencilsBurn in testWave soldering (lead-free)
Senju solder pasteBox BuildingX-ray

Mil Grade PCB Assembly Process Control

NOD Electronics fully show respect to your strict confidentiality of documentation and procedures and has formalized a range of control process that can ensure customer products in delivery of good quality. We will operate the process during Incoming Quality Control (IQC), In-Process Quality Control (IPQC), Outgoing Quality Assurance (OQA) etc stages and management methods ISO, 7 sigma, PDCA.

pcb assembly process control

Our PCB prototypes are turned quickly to meet your specifications and delivery requirements.  Our electronic manufacturing production goes through a thorough circuit board test and inspection process that includes automated x-ray inspection, functional testing, flying probe testing, and even manual inspection as required.


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TAG:  PCB assembly