Organic Solderability Preservative PCB Assembly

OSP (Organic Solderability Preservative) or anti-tarnish preserves the copper surface from oxidation by applying a very thin protective layer of material over the exposed copper usually using a conveyorized process.​

Laminate : FR-4
Layers : Double-sided
Laminate Thickness : 1.0mm
Copper Thickness : 1.0oz
Surface Finish : OSP
Assembly : SMT & DIP
Test : Function Test
Package : Carton
Standards : IPC-A-610E
Lead Free : RoHS
Min. Chips : 0201

Organic Solderability Preservative PCB Assembly

OSP (Organic Solderability Preservative) or anti-tarnish preserves the copper surface from oxidation by applying a very thin protective layer of material over the exposed copper usually using a conveyorized process.

Organic Solderability Preservative PCB Assembly Capabilities

7 SMT linesUp to 12 layersFuji & Samsung SMT mounters
4 DIP linesSMT/DIPAuto solder paste screen printer
0201 componentIn circuit testReflow ovens with 10 zones
0.25mm BGAFunction circuit testAuto optical inspection
Laser stencilsBurn in testWave soldering (lead-free)
Senju solder pasteBox BuildingX-ray

Organic Solderability Preservative PCB Assembly Process Control

NOD Electronics fully show respect to your strict confidentiality of documentation and procedures and has formalized a range of control process that can ensure customer products in delivery of good quality. We will operate the process during Incoming Quality Control (IQC), In-Process Quality Control (IPQC), Outgoing Quality Assurance (OQA) etc stages and management methods ISO, 7 sigma, PDCA.

pcb assembly process control

Take advantage of our strength and experience and allow us to help you maintain your competitive edge. NOD Electronics can well positioned to support our customers through the entire product life cycle, from concept to volume production.


Contact NOD Electronics Now!


TAG:  PCB assembly