Semi-flex PCBS PCB Assembly

The semi-flex stack-up offers significant cost advantages compared to traditional rigid-flex PCBAs and is well suited for static bending stress during assembly and installation.

Laminate : CEM-3
Layers : 4
Laminate Thickness : 1.0mm
Copper Thickness : 1.0oz
Surface Finish : OSP
Assembly : SMT & DIP
Test : Function Test
Package : Foam
Standards : TS16949
Lead Free : RoHS
Min. Chips : 0201

Semi-flex PCBS PCB Assembly

Since 2002 we have seen a growing request for flexible-, flex-rigid circuits. And over the latest years, an increase request for semi-flex circuits. Semi-flex PCBs use specialized FR-4 materials and a specific manufacturing method to create a flex-to-install design that can provide an economical solution for certain applications.

Semi-flex PCBS PCB Assembly Capabilities

7 SMT linesUp to 12 layersFuji & Samsung SMT mounters
4 DIP linesSMT/DIPAuto solder paste screen printer
0201 componentIn circuit testReflow ovens with 10 zones
0.25mm BGAFunction circuit testAuto optical inspection
Laser stencilsBurn in testWave soldering (lead-free)
Senju solder pasteBox BuildingX-ray

Semi-flex PCBS PCB Assembly Process Control

NOD Electronics fully show respect to your strict confidentiality of documentation and procedures and has formalized a range of control process that can ensure customer products in delivery of good quality. We will operate the process during Incoming Quality Control (IQC), In-Process Quality Control (IPQC), Outgoing Quality Assurance (OQA) etc stages and management methods ISO, 7 sigma, PDCA.

pcb assembly process control

The semi-flex stack-up offers significant cost advantages compared to traditional rigid-flex PCBAs and is well suited for static bending stress during assembly and installation. Take advantage of our strength and experience and allow us to help you maintain your competitive edge. NOD Electronics can well positioned to support our customers through the entire product life cycle, from concept to volume production.


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TAG:  PCB assembly