Sensor Carbon Ink PCB Assembly

For Sensor Carbon Ink PCB assembly, this PCB assembly from Guangzhou NOD Electronics Co. Ltd is based on an HDI board, and integrates 0201, 0402, 0603, 0805, 1210 and 2512 components.

Laminate : CEM-1
Layers : Single
Laminate Thickness : 1.0mm
Copper Thickness : heavy copper
Surface Finish : OSP
Assembly : Box Building
Test : Burn In Test
Package : Foam
Standards : IPC-A-610E
Lead Free : Lead
Min. Chips : 0201

Sensor Carbon Ink PCB Assembly

For Sensor Carbon Ink PCB assembly, this PCB assembly from Guangzhou NOD Electronics Co. Ltd is based on an HDI board, and integrates 0201, 0402, 0603, 0805, 1210 and 2512 components. SMT and DIP processes are used. The unit undergoes automated optical inspection, and in-circuit and functional testing. Production complies with IPC-A-160 requirements.

Sensor Carbon Ink PCB Assembly Capabilities

7 SMT linesUp to 12 layersFuji & Samsung SMT mounters
4 DIP linesSMT/DIPAuto solder paste screen printer
0201 componentIn circuit testReflow ovens with 10 zones
0.25mm BGAFunction circuit testAuto optical inspection
Laser stencilsBurn in testWave soldering (lead-free)
Senju solder pasteBox BuildingX-ray

Sensor Carbon Ink PCB Assembly Process Control

NOD Electronics fully show respect to your strict confidentiality of documentation and procedures and has formalized a range of control process that can ensure customer products in delivery of good quality. We will operate the process during Incoming Quality Control (IQC), In-Process Quality Control (IPQC), Outgoing Quality Assurance (OQA) etc stages and management methods ISO, 7 sigma, PDCA.

pcb assembly process control

NOD Electronics' motto is quality, efficiency and competitive price. We strictly adhere to the TS14969 standards, and continuously apply advanced international technology to improve the quality of the product to meet needs of our customers.


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TAG:  PCB assembly