Thermal Management for Power Components PCB Assembly

Modern power components place high demands on the PCB. NOD Electronics' PCB technology permits the selective embedding of thick copper pieces in standard FR4 PCBs, resulting in optimised thermal management for individual hotspots.​

Laminate : FR-4
Layers : Double-sided
Laminate Thickness : 1.0mm
Copper Thickness : 1.5oz
Surface Finish : ENIG
Assembly : SMT & DIP
Test : Burn In Test
Package : Carton
Standards : CE
Lead Free : RoHS
Min. Chips : 0201

Thermal Management for Power Components

Modern power components place high demands on the PCBA. NOD Electronics' PCB technology permits the selective embedding of thick copper pieces in standard FR4 PCBs, resulting in optimised thermal management for individual hotspots.

Capabilities of Thermal Management for Power Components 

7 SMT linesUp to 12 layersFuji & Samsung SMT mounters
4 DIP linesSMT/DIPAuto solder paste screen printer
0201 componentIn circuit testReflow ovens with 10 zones
0.25mm BGAFunction circuit testAuto optical inspection
Laser stencilsBurn in testWave soldering (lead-free)
Senju solder pasteBox BuildingX-ray

Process Control of Thermal Management for Power Components

NOD Electronics fully show respect to your strict confidentiality of documentation and procedures and has formalized a range of control process that can ensure customer products in delivery of good quality. We will operate the process during Incoming Quality Control (IQC), In-Process Quality Control (IPQC), Outgoing Quality Assurance (OQA) etc stages and management methods ISO, 7 sigma, PDCA.

pcb assembly process control

Our team will provide you with straightforward, expert and active support in the implementation of your power application, to ensure that your requirements are met, both technically and economically.


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TAG:  PCB assembly