Conductive Carbon Ink PCB Manufacturing
  • Detailed information

    Conductive Carbon Ink PCB Manufacturing

    NOD Electronics' product range of conductive, dielectric and other functional polymer thick film inks have been used to apply selective coatings on a variety of flexible and rigid substrates, via screen, flexographic and rotogravure printing methods.

    Our Capabilities of Conductive Carbon Ink PCB Manufacturing

    Total Pad SizeStandardAdvanced
    Capture PadDrill + 0.008Drill + 0.006
    Landing PadDrill + 0.008Drill + 0.006
    BC Mechanical Drill (Type III)0.0080.006
    Laser Drill Size0.004-0.0100.0025
    Material Thickness0.00350.0025
    Stacked ViaYesYes
    Type I Capabilities single & Double DeepYesYes
    Type II Capabilities Buried Vias with MicroviasYesYes
    Type III CapabilitiesYesYes
    Copper Filled MicroviaYesYes
    Smallest Copper Filled Microvia0.0040.0025
    Copper Filled Microvia Aspect Ratio0.75:11:1
    Smallest Laser Microvia Hole Size0.0040.0025
    Laser Via Aspect Ratio (Depth:Diameter)0.75:11:1

    Costs and Quotation of Conductive Carbon Ink PCB Manufacturing

    The total costs of conductive carbon Ink PCB manufacturing and assembly services are mainly determined by PCB dimension, laminate thickness, surface finish, layer(s), other special technical requirements (such as blind & buried via, impedance), components, numbers of soldering pads and test plan. You can send PCB files (Gerbers) and BOM to get instant quotation within 24 hours

    At NOD Electronics we pride ourselves on having flexible approach to manufacturing listening to our clients and being responsive to them. Couple this with the investment we have made to bring in state of the art machinery to assemble the latest components. We can offer an PCBA assembly service from prototype batches to high-volume production.


Conductive Carbon Ink PCB Manufacturing

NOD Electronics' product range of conductive, dielectric and other functional polymer thick film inks have been used to apply selective coatings on a variety of flexible and rigid substrates, via screen, flexographic and rotogravure printing methods.


Copyright 2009-2024 All Rights Reserved by NOD Electronics
Building A01 & C03, Ping’an Silicon Valley, Zengcheng District, Guangzhou 511399, China
Powered by MetInfo 7.2.0 ©2008-2024  mituo.cn