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Detailed information
ENIG is quickly becoming the most popular surface finish in the industry. It’s a double layer metallic coating, with nickel acting as both a barrier to the copper and a surface to which components are soldered. A layer of gold protects the nickel during storage. ENIG is an answer to major industry trends such as lead-free requirements and rise of complex surface components (especially BGAs and flip chips), which require flat surfaces. But ENIG can be expensive, and at times can result in what is commonly known as “black pad syndrome,” a buildup of phosphorous between the gold and nickel layers that can result in fractured surfaces and faulty connections. But we have a strong ability to solve the problems in the process and ensure the quality of the process.
Our Capabilities of PCB Fabrication
Total Pad Size Standard Advanced Capture Pad Drill + 0.008 Drill + 0.006 Landing Pad Drill + 0.008 Drill + 0.006 BC Mechanical Drill (Type III) 0.008 0.006 Laser Drill Size 0.004-0.010 0.0025 Material Thickness 0.0035 0.0025 Stacked Via Yes Yes Type I Capabilities single & Double Deep Yes Yes Type II Capabilities Buried Vias with Microvias Yes Yes Type III Capabilities Yes Yes Copper Filled Microvia Yes Yes Smallest Copper Filled Microvia 0.004 0.0025 Copper Filled Microvia Aspect Ratio 0.75:1 1:1 Smallest Laser Microvia Hole Size 0.004 0.0025 Laser Via Aspect Ratio (Depth:Diameter) 0.75:1 1:1 NOD Electronics strives to support international small-medium business with 10+ years engineering experience in Electronic Manufacturing Services (EMS). Our PCB fabrication capabilities can meet almost 95% demand of custom requirements and actually we concentrated on this field for decades.
High-end ENIG PCB Fabrication and Assembly
NOD Electronics strives to support international small-medium business with 10+ years engineering experience in Electronic Manufacturing Services (EMS). Our PCB fabrication capabilities can meet almost 95% demand of custom requirements and actually we concentrated on this field for decades.
