CEM-1 PCB Fabrication and Assembly

NOD Electronics are specialized in the production of carbon ink printed circuit board approved by ISO9001 and ISO2001. Now we are the secondary supplier of Casio with huge production volume.

Laminate : CEM-1
Type : Rigid
Layers : Single Layer
Application : Communication
Surface Finish : HASL
Copper Thickness : 0.5oz
Laminate Thickness : 0.8mm

Composite epoxy materials (CEM) are a group of composite materials typically made from woven glass fabric surfaces and non-woven glass core combined with epoxy synthetic resin. They are typically used in printed circuit boards. CEM-1 is low-cost, flame-retardant, cellulose-paper-based laminate with only one layer of woven glass fabric.

Our Capabilities of PCB Fabrication

Total Pad SizeStandardAdvanced
Capture PadDrill + 0.008Drill + 0.006
Landing PadDrill + 0.008Drill + 0.006
BC Mechanical Drill (Type III)0.0080.006
Laser Drill Size0.004-0.0100.0025
Material Thickness0.00350.0025
Stacked ViaYesYes
Type I Capabilities single & Double DeepYesYes
Type II Capabilities Buried Vias with MicroviasYesYes
Type III CapabilitiesYesYes
Copper Filled MicroviaYesYes
Smallest Copper Filled Microvia0.0040.0025
Copper Filled Microvia Aspect Ratio0.75:11:1
Smallest Laser Microvia Hole Size0.0040.0025
Laser Via Aspect Ratio (Depth:Diameter)0.75:11:1

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