Full Range of PCB Manufacturing Capabilities to Apply All of Your Printed Circuit Board Needs

We are a one-stop PCB manufacturer and PCB assembler, providing some of the most advanced PCB technology and convenient services applied in the industry: Full Spec PCBs, Small Quantity – Quick Turn PCBs, Custom Spec – Quick Turn PCBs, Highly Specialized Precision PCBs, & Large Scale Production. We expect to be a premier vendor of PCBs to the medical/health care, musical instrument, military/defense, aerospace, communication and commercial industries.

Total Pad SizeStandardAdvanced
Capture PadDrill + 0.008Drill + 0.006
Landing PadDrill + 0.008Drill + 0.006
BC Mechanical Drill (Type III)0.0080.006
Laser Drill Size0.004-0.0100.0025
Material Thickness0.00350.0025
Stacked ViaYesYes
Type I Capabilities single & Double DeepYesYes
Type II Capabilities Buried Vias with MicroviasYesYes
Type III CapabilitiesYesYes
Copper Filled MicroviaYesYes
Smallest Copper Filled Microvia0.0040.0025
Copper Filled Microvia Aspect Ratio0.75:11:1
Smallest Laser Microvia Hole Size0.0040.0025
Laser Via Aspect Ratio (Depth:Diameter)0.75:11:1


PCB Assembly Capabilities

We comprehensively understand our customer PCB assembly needs and take their time-to-market, here is why our customers choose us for their PCB Manufacturing & Assembly needs. If you find a lower price, let us beat it. These days it's easy to check a PCB manufacturer's ratings. We invite you to review our reputation and above capabilities. It is sure that you will find us featured by exceptional reliability, quick turnaround and responsive customer service. We strive to be your reliable partner, not supplier.

Turn TimesSelected VolumeSelected Solder Types
  • Same day through four weeks turns

  • Scheduled deliveries

  • No minimum order quantity

  • Engineering prototypes

  • Low cost first article builds

  • Leaded

  • Lead-free/RoHS compliant

  • No-clean process available

Parts ProcurementSelected StencilsSelected Ball Grid Arrays (BGA)
  • Turnkey

  • Kitted/Consigned

  • Partial Turnkey

  • Laser cut stainless steel

  • Nano-coating available

  • As small as .5mm pitch

  • All BGA placements are x-ray inspected

Assembly TypesSelected Component TypesSelected Other Capabilities
  • Surface Mount (SMT)

  • Thru-hole

  • Mixed Technology (SMT/Thru-hole)

  • Single or double sided placement

  • As small as 0402 package

  • As small as 0201 with design review

  • Pitch components as small as 15 mil

  • Repair/Rework services

  • Mechanical Assembly

  • Box Build/Electromechanical Assembly

  • Sub-assemblies


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Building A01 & C03, Ping’an Silicon Valley, Zengcheng District, Guangzhou 511399, China
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