EXCELLENT QUALITY MANAGEMENT

NOD Electronics built a Quality Management System (QMS) to ensure excellent delivery of printed circuit boards and assembled products. Our QMS structure looks like this:

DEATILS OF OUR QUALITY CONTROLS

• DFM Check

  DFM checks of customer’s PCB, BOM, schematics, box build manuals according to:
  Last update time and version of production docs
  RoHS, Lead free
  Clear designators of components with direction
  Complete component descriptions of part number, manufacturer, designator in BOM
  Exact engineering requests of PCB fabrication including laminate, layers, copper weight, thickness, surface finish, impedance control, special via
  Reasonable circuit layouts, panel, solder mask and drilling hole diameters
  Right pick & place file
  Procedure of programming and test
  Specific box build manuals
  Other special technical requirements

• New Product Introduction

  Engage a new product introduction meeting to make following things clear:
  Customer project background, product application, lead time and special requirements
  Internal # of customer
  Production #, batch & volume
  Evaluation of manufacturing capabilities
  Lead time of components procurement & backups
  PMC
  Engineering processes
  Test plan

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• PCB Manufacturing

  We make PCBs in compliance with:
  High grade laminate according to IPC standards
  Select quality and experienced PCB manufacturer and periodically inspect their factories
  High-end manufacturing capabilities, including multilayers, HDI, impedance control, blind & buried via
  100% electrical test before delivery
  Advanced facilities
  Carefully check PCB stacks and confirm EQs with customer

• Components Procurement

  100% original from manufacturers listed in BOM
  Manufacturer certificates available
  Lead time controlled
  Resources to keep stock in the market
  Cost savings of component procurement
  Only sourcing from assigned general agency, such as Avnet, mouser, arrow, element14
  Ability of providing cost down solutions in long term

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• Incoming Material Quality Control

  Incoming material control by inspection of following items:
  PCB Fabrication
  Thickness: caliper measurement
  Hole: if non-through, covering solder mask
  Pads: if flat, clean and uniform
  Silk screen: if clear
  If PCB warped, scraped, broken circuits
  Electrical inspection: test on voltage/current between points on basis of customer plan
  Temperature test: check bare PCB after reflow soldering
  Solder paste immersion: effect test of solder paste after reflow soldering
  Components
  Check footprints, shape (scraped, deformed, short pin)
  Value tests

• Storage & Printing

  Storage of sensible components under constant temperature and humidity and record in forms. If exposure time is over the defined value of MSL, they will be sent for baking.
  Baking of PCB/IC/BGA for 2-12 hours to remove moisture
  Select big manufacturer of solder paste, such as Senju
  Issue laser stencil for solder paste printing
  Equipped automatic solder paste printer and SPI to ensure uniformity

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• Soldering

  Samsung SM471/481/482, Fuji CP8/CP6 series
  Electrical feeder to reduce dissipation and possibility of warnings
  01005” chips available (smallest 0.4mm x 0.2mm)
  Package QFN, SOP, SOT, TSOP, QFP, BGA, PLCC available
  Maximum 75,000 chips/hour for Samsung SM471
  Temperature curve configurations, 4-hours interval of temperature inspection
  Find board defectives by automatic optical inspection
  Check soldering effects of balls by x-Ray station
  Manage BGA rework and reballing at house
  SOP guides for each work station
  Issue fixture to ensure conformity and reliability of wave soldering
  Import wave soldering machine from big brand manufacturer
  Install 2 through hole soldering production lines to comply with customer’s mass production
  Use our own engraving machine to issue test fixture and capable of programming and function test

CONTACT US TO GET INSTANT QUOTE