SMD Hand Soldering Methods

SMD Hand Soldering Methods

Publish Date:2016-10-11 13:35:31 Clicks: 58

SMD Hand Soldering Methods:

  • Method 1 – Pin by pin Used for : two pin components (0805 caps & res), pitches >= 0.0315″ in Small Outline Package, (T)QFP and SOT (Mini 3P).

  • Method 2 – Flood and suck Used for : pitches <= 0.0315″ in Small Outline Package and (T)QFP

  • Method 3 – Solder paste Used for BGA, MLF / MLA packages; where the pins are underneath the part and inaccessible.


BGA or Ball Grid Array is one type of packaging for surface-mounted PCBs (where components are actually ‘mounted’ or affixed on the surface of the printed circuit board). A BGA package simply looks like a thin wafer of semi-conducting material that has circuit components on only one face. The Ball Grid Array package is called such because it is basically an array of metal alloy balls arranged in a grid. These BGA Balls are normally Tin/Lead (Sn/Pb 63/37) or Tin/Lead/Silver (Sn/Pb/Ag)

label: Solder

Copyright 2009-2024 All Rights Reserved by NOD Electronics
Building A01 & C03, Ping’an Silicon Valley, Zengcheng District, Guangzhou 511399, China
Powered by MetInfo 7.2.0 ©2008-2024