Method and Procedure for PCBA Failure Analysis
To get PCBA failure analysis reasons:
To accept the failure information feedback and analysis request from site and customers
To remark what customers complain
Model, Batch Number, Failure Rate and the proportion
Appearance inspection, production information
Failure mode phenomenon, parameter value
The difference between passed products
The failure analysis of PCBA has the following three reasons:
When PCBA appears problem, it must fist check the basic conditions of manufacturing process, also
These not only include chemical materials of sold paste, such as flux, oil, tin, cleaning materials. Also cladding materials of PCB, such as anti-oxidation resin, temporary or permanent anti-welding ink and printing ink and so on.
This involves all solder surfaces, like parts ( including surface-attached parts / SMT parts), PCB and plating drilling, which must be taken into account.
3/The deviation of manufacturing equipment
Including the deviation of machine equipment and maintenance and the external factors, temperature, conveyor belt speed and angle as well as the depth of soaking, etc; and the machine is directly related to variable. In addition, the external factors such as the ventilation, the reduction of air pressure and the conversion of voltage, etc, which must also be included in the analysis.