What is PCBA X-ray Detection?
The PCBA x-ray check is based on the same principle as the Automatic Optical Inspection (AOI). It uses X-rays as its source, not the visible light, to automatically detect faults that are usually hidden on the PCBA (BGA, QFN, QFP, etc.) components such as tin, open circuit, and so on. The main role is process optimization and anomaly checking. Besides, with the increasing miniaturization in terms of semiconductor components package, while considering X-ray inspection system, compared with other inspection methods, X-ray is capable of penetrating into inner packaging and inspecting the quality of solder joints.
The Roles of PCBA X-ray Detection.
The coverage of process defects is as high as 97% and the checkable defects include: weld, bridge, monument, solder shortage, stomata, components missing and so on. Especially, it is possible to check BGA, CSP and other solder joint devices.
Preparing time is greatly reduced.
Only check one time for double and multilayer boards with stratification.
Provide the relevant measurement information to evaluate the production process.