After the PCBA is soldered, the PCBA board will have tin, flux, dust and employee fingerprints, which will cause the surface of the PCBA board to be dirty, and the organic acids and ions in the flux r...

The stencil of PCBA processing patch is used to print red glue or solder paste on the PCB....

What are the hazards of welding contamination after PCBA processing?...

What are the main pollutants of PCBA after processing...

In the process of PCBA processing, solder paste and flux will produce residues, which contain organic acids and decomposable ions....

Generally, the main reasons that affect the bad welding of QFN package are: PCB board design defects, pad pollution, QFN device welding end pollution, QFN device damp, steel mesh design defects, poor ...

Many customers and engineers don't know how to choose a suitable PCBA manufacturer in China. After all, PCBA is a very complicated professional process, from pre-communication, procurement, to product...

When a diode falls out of material, we need to analyze the possible causes, and then again and again to investigate and solve, the general occurrence of the accident, we can from the glue quality, the...