0201 PCB Assembly
  • Detailed information

    0201 PCB Assembly

    The continued drive toward miniaturization has seen component sizes decrease while board densities have increased. The world's most advanced semiconductor packages are facing new challenges with the adoption of 0201 passive components. These challenging components will push high-speed assembly equipment to even more exacting parameters.

    0201 PCB Assembly Capabilities

    7 SMT linesUp to 12 layersFuji & Samsung SMT mounters
    4 DIP linesSMT/DIPAuto solder paste screen printer
    0201 componentIn circuit testReflow ovens with 10 zones
    0.25mm BGAFunction circuit testAuto optical inspection
    Laser stencilsBurn in testWave soldering (lead-free)
    Senju solder pasteBox BuildingX-ray

    0201 PCB Assembly Process Control

    NOD Electronics fully show respect to your strict confidentiality of documentation and procedures and has formalized a range of control process that can ensure customer products in delivery of good quality. We will operate the process during Incoming Quality Control (IQC), In-Process Quality Control (IPQC), Outgoing Quality Assurance (OQA) etc stages and management methods ISO, 7 sigma, PDCA.

    pcb assembly process control

    NOD Electronics Ltd is based in China and provides a quality PCB assembly service including single & double sided SMT board assembly and fine pitch component placement from 0201 through to 50 x 50mm QFP’s including BGA’s and QFN’s. Our flexibility in satisfying existing and prospective customer’s needs coupled with our responsive behavior to their specific requirements plays a key role in our continued success – 7 years in the making.


0201 PCB Assembly

The continued drive toward miniaturization has seen component sizes decrease while board densities have increased. The world's most advanced semiconductor packages are facing new challenges with the adoption of 0201 passive components.

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