0201 PCB Manufacturing
The continued drive toward miniaturization has seen component sizes decrease while board densities have increased. The world's most advanced semiconductor packages are facing new challenges with the adoption of 0201 passive components. These challenging components will push high-speed assembly equipment to even more exacting parameters.
Our Capabilities of 0201 PCB Manufacturing
Total Pad Size Standard Advanced Capture Pad Drill + 0.008 Drill + 0.006 Landing Pad Drill + 0.008 Drill + 0.006 BC Mechanical Drill (Type III) 0.008 0.006 Laser Drill Size 0.004-0.010 0.0025 Material Thickness 0.0035 0.0025 Stacked Via Yes Yes Type I Capabilities single & Double Deep Yes Yes Type II Capabilities Buried Vias with Microvias Yes Yes Type III Capabilities Yes Yes Copper Filled Microvia Yes Yes Smallest Copper Filled Microvia 0.004 0.0025 Copper Filled Microvia Aspect Ratio 0.75:1 1:1 Smallest Laser Microvia Hole Size 0.004 0.0025 Laser Via Aspect Ratio (Depth:Diameter) 0.75:1 1:1
Costs and Quotation of 0201 PCB Manufacturing
The total costs of 0201 PCB manufacturing and assembly services are mainly determined by PCB dimension, laminate thickness, surface finish, layer(s), other special technical requirements (such as blind & buried via, impedance), components, numbers of soldering pads and test plan. You can send PCB files (Gerbers) and BOM to get instant quotation within 24 hours.
NOD Electronics Ltd is based in China and provides a quality PCB assembly service including single & double sided SMT board assembly and fine pitch component placement from 0201 through to 50 x 50mm QFP’s including BGA’s and QFN’s. Our flexibility in satisfying existing and prospective customer’s needs coupled with our responsive behavior to their specific requirements plays a key role in our continued success – 7 years in the making.