Sensor Carbon Ink PCB Manufacturing
For sensor carbon Ink PCB assembly, this PCB assembly from Guangzhou NOD Electronics Co. Ltd is based on an HDI board, and integrates 0201, 0402, 0603, 0805, 1210 and 2512 components. SMT and DIP processes are used. The unit undergoes automated optical inspection, and in-circuit and functional testing. Production complies with IPC-A-160 requirements.
Our Capabilities of Sensor Carbon Ink PCB Manufacturing
Total Pad Size Standard Advanced Capture Pad Drill + 0.008 Drill + 0.006 Landing Pad Drill + 0.008 Drill + 0.006 BC Mechanical Drill (Type III) 0.008 0.006 Laser Drill Size 0.004-0.010 0.0025 Material Thickness 0.0035 0.0025 Stacked Via Yes Yes Type I Capabilities single & Double Deep Yes Yes Type II Capabilities Buried Vias with Microvias Yes Yes Type III Capabilities Yes Yes Copper Filled Microvia Yes Yes Smallest Copper Filled Microvia 0.004 0.0025 Copper Filled Microvia Aspect Ratio 0.75:1 1:1 Smallest Laser Microvia Hole Size 0.004 0.0025 Laser Via Aspect Ratio (Depth:Diameter) 0.75:1 1:1
Costs and Quotation of Sensor Carbon Ink PCB Manufacturing
The total costs of sensor carbon Ink PCB manufacturing and assembly services are mainly determined by PCB dimension, laminate thickness, surface finish, layer(s), other special technical requirements (such as blind & buried via, impedance), components, numbers of soldering pads and test plan. You can send PCB files (Gerbers) and BOM to get instant quotation within 24 hours
NOD Electronics' motto is quality, efficiency and competitive price. We strictly adhere to the TS14969 standards, and continuously apply advanced international technology to improve the quality of the product to meet needs of our customers.