BGA Soldering PCB Manufacturing
  • Detailed information

    BGA Soldering PCB Manufacturing

    The Ball Grid Array or BGA, is a very different package to those using pins, such as the quad flat pack. The pins of the BGA package are arranged in a grid pattern and this gives rise to the name. In addition to this, rather than having the more traditional wire pins for the connections, pads with balls of solder are used instead. On the printed circuit board, PCB, onto which the BGA components are to be fitted there is a matching set of copper pads to provide the required connectivity.

    Our Capabilities of BGA Soldering PCB Manufacturing

    Total Pad SizeStandardAdvanced
    Capture PadDrill + 0.008Drill + 0.006
    Landing PadDrill + 0.008Drill + 0.006
    BC Mechanical Drill (Type III)0.0080.006
    Laser Drill Size0.004-0.0100.0025
    Material Thickness0.00350.0025
    Stacked ViaYesYes
    Type I Capabilities single & Double DeepYesYes
    Type II Capabilities Buried Vias with MicroviasYesYes
    Type III CapabilitiesYesYes
    Copper Filled MicroviaYesYes
    Smallest Copper Filled Microvia0.0040.0025
    Copper Filled Microvia Aspect Ratio0.75:11:1
    Smallest Laser Microvia Hole Size0.0040.0025
    Laser Via Aspect Ratio (Depth:Diameter)0.75:11:1

    Costs and Quotation of BGA Soldering PCB Manufacturing

    The total costs of BGA soldering PCB manufacturing and assembly services are mainly determined by PCB dimension, laminate thickness, surface finish, layer(s), other special technical requirements (such as blind & buried via, impedance), components, numbers of soldering pads and test plan. You can send PCB files (Gerbers) and BOM to get instant quotation within 24 hours

    NOD Electronics has a vast amount of expertise in Ball Grid Array PCB assembly (BGA). Our facilities house the most current BGA placement equipment as well as X-ray inspection equipment. We have developed over the years BGA assembly processes with a proven record of producing BGA circuit boards with excellent yield rates and the highest quality in the electronics manufacturing industry.


BGA Soldering PCB Manufacturing

The Ball Grid Array or BGA, is a very different package to those using pins, such as the quad flat pack. The pins of the BGA package are arranged in a grid pattern and this gives rise to the name.


Copyright 2009-2020 All Rights Reserved by NOD Electronics
Building E, Qixing Industrial Area, Xintang Town, Zengcheng District, Guangzhou 511340, China
Powered by MetInfo 7.2.0 ©2008-2021  mituo.cn