Through Hole PCB Manufacturing
Through-hole technology is deployed in many critical electronic assemblies. It is commonplace in power supplies and ruggedized electronic modules. At WPS we also have specialist expertise and experience of through-hole LED PCB assembly, with a capacity of 30,000 component insertions per hour. Our capability is supported by automated insertion equipment that delivers consistent assembly performance.
Our Capabilities of Through Hole PCB Manufacturing
Total Pad Size Standard Advanced Capture Pad Drill + 0.008 Drill + 0.006 Landing Pad Drill + 0.008 Drill + 0.006 BC Mechanical Drill (Type III) 0.008 0.006 Laser Drill Size 0.004-0.010 0.0025 Material Thickness 0.0035 0.0025 Stacked Via Yes Yes Type I Capabilities single & Double Deep Yes Yes Type II Capabilities Buried Vias with Microvias Yes Yes Type III Capabilities Yes Yes Copper Filled Microvia Yes Yes Smallest Copper Filled Microvia 0.004 0.0025 Copper Filled Microvia Aspect Ratio 0.75:1 1:1 Smallest Laser Microvia Hole Size 0.004 0.0025 Laser Via Aspect Ratio (Depth:Diameter) 0.75:1 1:1
Costs and Quotation of Through Hole PCB Manufacturing
The total costs of through hole PCB manufacturing and assembly services are mainly determined by PCB dimension, laminate thickness, surface finish, layer(s), other special technical requirements (such as blind & buried via, impedance), components, numbers of soldering pads and test plan. You can send PCB files (Gerbers) and BOM to get instant quotation within 24 hours
NOD Electronics staff are trained to IPC 610 Standards and offer a consistently high quality standard. Inevitably with through-hole jobs there is an element of interpretation of the customers’ requirements and it is by attention to detail and careful recording of the specific requirements of each assembly that we are able to offer a consistently high quality product.
In addition to offering the all types of through-hole assembly, NOD Electronics also offers useful additional services for final finishing of the product. Conformal coating and complete PCB encapsulation.