Application-specific PCBS Manufacturing
NOD Electronics' application-specific PCBS assembly offers a full turnkey electronic manufacturing operation, including assemblies, modules, systems complete with testing and coating capabilities, in a domestic facility.
Our Capabilities of Application-specific PCBS Manufacturing
Total Pad Size Standard Advanced Capture Pad Drill + 0.008 Drill + 0.006 Landing Pad Drill + 0.008 Drill + 0.006 BC Mechanical Drill (Type III) 0.008 0.006 Laser Drill Size 0.004-0.010 0.0025 Material Thickness 0.0035 0.0025 Stacked Via Yes Yes Type I Capabilities single & Double Deep Yes Yes Type II Capabilities Buried Vias with Microvias Yes Yes Type III Capabilities Yes Yes Copper Filled Microvia Yes Yes Smallest Copper Filled Microvia 0.004 0.0025 Copper Filled Microvia Aspect Ratio 0.75:1 1:1 Smallest Laser Microvia Hole Size 0.004 0.0025 Laser Via Aspect Ratio (Depth:Diameter) 0.75:1 1:1
Costs and Quotation of Application-specific PCBS Manufacturing
The total costs of Application-specific PCB manufacturing and assembly services are mainly determined by PCB dimension, laminate thickness, surface finish, layer(s), other special technical requirements (such as blind & buried via, impedance), components, numbers of soldering pads and test plan. You can send PCB files (Gerbers) and BOM to get instant quotation within 24 hours.
We hold numerous industry certifications and are uniquely experienced meeting the requirements of many demanding military and aerospace standards. Our commitment to quality ensured that this component met all tolerance requirements as well as DOD-STD-1686, Class 2 standard for electrical discharge and MIL-STD-2000 for soldered electrical assemblies.