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Detailed information
Universal Remote PCB Manufacturing
Guangzhou NOD Electronic Co., Ltd, ever since it was established in 201, has been committed to EMS (electronic manufacturing services) industry and dedicated to provide professional manufacturing, OEM, ODM services for electronic products to our vast domestic and overseas customers for over 11 years. NOD Electronics is specialized in manufacturing all kinds of PCB&PCBA for universal remote circuit, home appliance, communication industry, car industry and LED lights industry.
Our Capabilities of Universal Remote PCB Manufacturing
Total Pad Size Standard Advanced Capture Pad Drill + 0.008 Drill + 0.006 Landing Pad Drill + 0.008 Drill + 0.006 BC Mechanical Drill (Type III) 0.008 0.006 Laser Drill Size 0.004-0.010 0.0025 Material Thickness 0.0035 0.0025 Stacked Via Yes Yes Type I Capabilities single & Double Deep Yes Yes Type II Capabilities Buried Vias with Microvias Yes Yes Type III Capabilities Yes Yes Copper Filled Microvia Yes Yes Smallest Copper Filled Microvia 0.004 0.0025 Copper Filled Microvia Aspect Ratio 0.75:1 1:1 Smallest Laser Microvia Hole Size 0.004 0.0025 Laser Via Aspect Ratio (Depth:Diameter) 0.75:1 1:1 Costs and Quotation of Universal Remote PCB Manufacturing
The total costs of universal remote PCB manufacturing and assembly services are mainly determined by PCB dimension, laminate thickness, surface finish, layer(s), other special technical requirements (such as blind & buried via, impedance), components, numbers of soldering pads and test plan. You can send PCB files (Gerbers) and BOM to get instant quotation within 24 hours.
We also have an international purchase team with abundant experiences who have rich purchase experiences in all kinds of electronic parts and components, plastic parts and hardware. Strictly implementing supplier qualification investigation and approval system, they are able to purchase source parts and components with high reliability and cost performance on a global scale, which brings conditions for enhancing products’ market competitiveness.