Backplane PCB Assembly
NOD Electronics is a major supplier of backplane assemblies and custom PCBA solutions. We expertise in high-speed interconnection offers a full range of backplane/midplane assembly solutions, from concept to manufacturing.
Backplane PCB Assembly Capabilities
7 SMT lines Up to 12 layers Fuji & Samsung SMT mounters 4 DIP lines SMT/DIP Auto solder paste screen printer 0201 component In circuit test Reflow ovens with 10 zones 0.25mm BGA Function circuit test Auto optical inspection Laser stencils Burn in test Wave soldering (lead-free) Senju solder paste Box Building X-ray
Backplane PCB Assembly Process Control
NOD Electronics fully show respect to your strict confidentiality of documentation and procedures and has formalized a range of control process that can ensure customer products in delivery of good quality. We will operate the process during Incoming Quality Control (IQC), In-Process Quality Control (IPQC), Outgoing Quality Assurance (OQA) etc stages and management methods ISO, 7 sigma, PDCA.
We can build all types and sizes of backplanes, including some of the largest and most sophisticated back-panels in the world. We offer both leaded and lead-free processes, to assemble components onto a printed circuit backplane board. Components include active and passive devices, thru-hole (soldered) components, press fit (compliant) components, and a variety of mounting hardware. Full test and AOI capabilities insure the highest quality delivered products.