BGA PCB Manufacturing
  • Detailed information

    BGA PCB Manufacturing

    NOD Electronics has a vast amount of processing experiences in Ball Grid Array Assembly (BGA). Our facilities house the most current BGA placement equipment as well as X-ray inspection equipment. We have developed over the years BGA assembly processes with a proven record of producing BGA circuit boards with excellent yield rates and the highest quality in the electronics manufacturing industry.

    We offer the entire gamut of manufacturing services for BGAs, including:

    • Ceramic BGA (CBGA)

    • Plastic BGA (PBGA)

    • Micro Fine Line BGA (MBGA)

    • Micro BGA

    • Stack BGAs

    • Leaded and Lead free BGAs

    Our Capabilities of BGA PCB Manufacturing

    Total Pad SizeStandardAdvanced
    Capture PadDrill + 0.008Drill + 0.006
    Landing PadDrill + 0.008Drill + 0.006
    BC Mechanical Drill (Type III)0.0080.006
    Laser Drill Size0.004-0.0100.0025
    Material Thickness0.00350.0025
    Stacked ViaYesYes
    Type I Capabilities single & Double DeepYesYes
    Type II Capabilities Buried Vias with MicroviasYesYes
    Type III CapabilitiesYesYes
    Copper Filled MicroviaYesYes
    Smallest Copper Filled Microvia0.0040.0025
    Copper Filled Microvia Aspect Ratio0.75:11:1
    Smallest Laser Microvia Hole Size0.0040.0025
    Laser Via Aspect Ratio (Depth:Diameter)0.75:11:1

    Costs and Quotation of BGA PCB Manufacturing

    The total costs of BGA PCB manufacturing and PCB assembly services are mainly determined by PCB dimension, laminate thickness, surface finish, layer(s), other special technical requirements (such as blind & buried via, impedance), components, numbers of soldering pads and test plan. You can send PCB files (Gerbers) and BOM to get instant quotation within 24 hours.

    Apart from these, we can also provide rework and reballing services for BGAs that are already in use. Our rework and reballing capabilities include BGA removal and replacement, rework of ceramic and plastic BGAs and reballing of MBGAs. NOD Electronics becomes a one stop destination for all your BGA assembly services.


BGA PCB Manufacturing

NOD Electronics has a vast amount of processing experiences in Ball Grid Array Assembly (BGA). Our facilities house the most current BGA placement equipment as well as X-ray inspection equipment.


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Building E, Qixing Industrial Area, Xintang Town, Zengcheng District, Guangzhou 511340, China
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