BGA Soldering PCB Assembly

The Ball Grid Array or BGA, is a very different package to those using pins, such as the quad flat pack. The pins of the BGA package are arranged in a grid pattern and this gives rise to the name. In addition to this, rather than having the more traditional wire pins for the connections, pads with balls of solder are used instead. On the printed circuit board, PCB, onto which the BGA components are to be fitted there is a matching set of copper pads to provide the required connectivity.

BGA Soldering PCB Assembly Capabilities

BGA Soldering PCB Assembly Process Control

NOD Electronics fully show respect to your strict confidentiality of documentation and procedures and has formalized a range of control process that can ensure customer products in delivery of good quality. We will operate the process during Incoming Quality Control (IQC), In-Process Quality Control (IPQC), Outgoing Quality Assurance (OQA) etc stages and management methods ISO, 7 sigma, PDCA.

NOD Electronics has a vast amount of expertise in Ball Grid Array PCB assembly (BGA). Our facilities house the most current BGA placement equipment as well as X-ray inspection equipment. We have developed over the years BGA assembly processes with a proven record of producing BGA circuit boards with excellent yield rates and the highest quality in the electronics manufacturing industry.