Blind Via PCB Assembly
  • Detailed information

    Blind Via PCB Assembly

    Vias, that is, copper plated holes, play a key role in the interconnection between layers in a printed circuit board. Generally speaking, vias in PCBs can be classified into the following categories: through-hole via, blind via and buried via. Blind/buried vias are widely applied in SMT (Surface Mount Technology) just to compensate for disadvantages of through-hole vias.

    Blind via connects one external layer and one or more inner layers in printed circuit board, responsible for interconnection between top layer and inner layers or bottom layer and inner layers.

    Blind Via PCB Assembly Capabilities

    7 SMT linesUp to 12 layersFuji & Samsung SMT mounters
    4 DIP linesSMT/DIPAuto solder paste screen printer
    0201 componentIn circuit testReflow ovens with 10 zones
    0.25mm BGAFunction circuit testAuto optical inspection
    Laser stencilsBurn in testWave soldering (lead-free)
    Senju solder pasteBox BuildingX-ray

    Blind Via PCB Assembly Process Control

    NOD Electronics fully show respect to your strict confidentiality of documentation and procedures and has formalized a range of control process that can ensure customer products in delivery of good quality. We will operate the process during Incoming Quality Control (IQC), In-Process Quality Control (IPQC), Outgoing Quality Assurance (OQA) etc stages and management methods ISO, 7 sigma, PDCA.

    pcb assembly process control

    Due to our over 10 years' experience in this industry, NOD Electronics specializes in manufacturing PCBs with blind/buried Vias. Both engineers and manufacturing equipment from NOD Electronics ensure our full capabilities in meeting the requirements of blind/buried via technology.

    Up to now, we're capable of providing mechanically drilled and laser drilled solutions. When it comes to mechanical drilling, via diameter ranges from 0.2mm to 0.4mm while 0.1mm for laser drilling.


Blind Via PCB Assembly

Blind via connects one external layer and one or more inner layers in printed circuit board, responsible for interconnection between top layer and inner layers or bottom layer and inner layers.

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