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Detailed information
CEM-1 Circuit Board
Composite epoxy materials (CEM) are a group of composite materials typically made from woven glass fabric surfaces and non-woven glass core combined with epoxy synthetic resin. They are typically used in printed circuit boards. CEM-1 is low-cost, flame-retardant, cellulose-paper-based laminate with only one layer of woven glass fabric.
Our Capabilities of Circuit Board Manufacturing
Through Hole HDI Flexible PCB Max. Layers 20 Min. Line Width/Space 0.05/0.05mm Max. Plate Size 2000*240mm Max. Plate Thickness 8.0mm Key Line/Tolerance 0.065/15% Max. Layers 10 Min. Plate Thickness 0.4mm Min. Blind Hole Diameter 0.10mm Min. Line Width/Space (1/4OZ) 0.04mm Max. thickness/Diameter Ratio 14:01 Blind Hole Loading Pad Size 0.23mm Min. Line Width/Space (1/3OZ) 0.05mm Max. Copper Thickness 4OZ PTH & Blind Hole Size 0.20mm Min. Line Width/Space (1/2OZ) 0.055mm Max. Plate Size 2000x610mm PTH PAD Size 0.35mm Min. Through Hole 0.15mm Min. Thickness of 4 Layers PCB 0.33mm Blind Hole thickness/Diameter Ratio 1:01 Min. Hole Pad 0.25mm Min. Mechanical Hole/Pad 0.15/0.35mm HDI Orders 3+N+3 Min. Laser Hole 0.10mm Drilling Precision +/-0.025mm Min. Thickness of 8 Layers PCB 0.8mm Min. Laser Hole Pad 0.25mm PTH Hole Tolerance +/-0.03mm Min. Pad Side Window 0.038mm Cover Film Alignment Tolerance 0.15mm Min. Line Width/Space 0.065/0.065mm Min. Ink Bridge 0.065mm Shape Tolerance 0.05mm Min. CSP/BGA Space / Min. Slot Width 0.60mm Impedance Tolerance ±5% Pitch Tolerance ±0.05mm Rigid Flex (YES/NO) Yes Air Gap (Yes/No) Yes Surface Finish: ENIG/OSP/ HASL/ Au Plating (soft/hard)/ Immersion Ag/ Immersion Tin/ Bright Tin Plating/Ag Plating/ Carbon Ink NOD Electronics has 10 years experience in CEM-1 PCB manufacturing and continues to pursue breakthroughs. We have opened new plants and introduced new advanced processing equipment. We can do fast delivery, and strictly control the quality of production to ensure the reliability of production.
CEM-1 Circuit Board
NOD Electronics has 10 years experience in CEM-1 circuit board manufacturing and continues to pursue breakthroughs. We have opened new plants and introduced new advanced processing equipment. We can do fast delivery, and strictly control the quality of production to ensure the reliability of production.
