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Detailed information
CEM-1 PCB Assembly
Regarding your CEM-1 PCB assembly demand, we have big capabilities for SMT/SMD assembly, through-hole and mixed technology PCB assemblies. BGA down to 0.25mm pitch, 0201 component placements and leadless devices assembly can also be available. High speed advanced Fuji SMT machines can well support your strict requirements of PCB assembly, whatever in relation to mil-spec, network, communication, health care, medical, musical instrument application. In terms of pass rate, we have done 99.9%. Our experienced and responsive engineering team will discuss about assembly manufacturing process once we get your order. The best work plan will be figured out and your PCBs are performed in quality online.
CEM-1 PCB Assembly Capabilities
NOD Electronics have 7 advance SMT lines, 4 box building and through hole lines, screen printer, reflow oven, wave soldering, cleaning system, x-Ray, BGA rework station, AOI and cleaning system. We can support any batch order volume (medium to small). More importantly, we have plenty experiences of offering PCB assembly samples. Economic and quick plans are waiting for your reviewing, because we really take your lead time and stands at initial stage of the projects. So in generally you can get PCB assembly boards in 15 days (including time of PCB manufacturing, components purchase, PCB assembly and test).
7 SMT lines Up to 12 layers Fuji & Samsung SMT mounters 4 DIP lines SMT/DIP Auto solder paste screen printer 0201 component In circuit test Reflow ovens with 10 zones 0.25mm BGA Function circuit test Auto optical inspection Laser stencils Burn in test Wave soldering (lead-free) Senju solder paste Box Building X-ray CEM-1 PCB Assembly Process Control
NOD Electronics fully show respect to your strict confidentiality of documentation and procedures and has formalized a range of control process that can ensure customer products in delivery of good quality. We will operate the process during Incoming Quality Control (IQC), In-Process Quality Control (IPQC), Outgoing Quality Assurance (OQA) etc stages and management methods ISO, 7 sigma, PDCA.
Composite epoxy materials (CEM) are a group of composite materials typically made from woven glass fabric surfaces and non-woven glass core combined with epoxy synthetic resin. They are typically used in printed circuit boards. CEM-1 is low-cost, flame-retardant, cellulose-paper-based laminate with only one layer of woven glass fabric.
CEM-1 PCB Assembly
Composite epoxy materials (CEM) are a group of composite materials typically made from woven glass fabric surfaces and non-woven glass core combined with epoxy synthetic resin. They are typically used in printed circuit boards. CEM-1 is low-cost, flame-retardant, cellulose-paper-based laminate with only one layer of woven glass fabric.