Detecting PCB Manufacturing
For Detecting Equipment, this PCB manufacturing from NOD Electronics is based on an HDI board, and integrates 0201, 0402, 0603, 0805, 1210 and 2512 components. SMT and DIP processes are used. The unit undergoes automated optical inspection, and in-circuit and functional testing. Production complies with IPC-A-160 requirements.
Our Capabilities of Detecting PCB Manufacturing
Total Pad Size Standard Advanced Capture Pad Drill + 0.008 Drill + 0.006 Landing Pad Drill + 0.008 Drill + 0.006 BC Mechanical Drill (Type III) 0.008 0.006 Laser Drill Size 0.004-0.010 0.0025 Material Thickness 0.0035 0.0025 Stacked Via Yes Yes Type I Capabilities single & Double Deep Yes Yes Type II Capabilities Buried Vias with Microvias Yes Yes Type III Capabilities Yes Yes Copper Filled Microvia Yes Yes Smallest Copper Filled Microvia 0.004 0.0025 Copper Filled Microvia Aspect Ratio 0.75:1 1:1 Smallest Laser Microvia Hole Size 0.004 0.0025 Laser Via Aspect Ratio (Depth:Diameter) 0.75:1 1:1
Costs and Quotation of Detecting PCB Manufacturing
The total costs of detecting PCB Manufacturing and PCB assembly services are mainly determined by PCB dimension, laminate thickness, surface finish, layer(s), other special technical requirements (such as blind & buried via, impedance), components, numbers of soldering pads and test plan. You can send PCB files (gerbers) and BOM to get instant quotation within 24 hours.
NOD Electronics has professional purchasers who are on the component market. Our factory is equipped with MPM solder paste printer, Samsung high-speed SMT mounter, YAMAHA high-speed SMT mounter, BTU reflow furnaces, AOI and a full set of lead-free equipment. We can deal with all kinds of integrated circuits such as SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA.