Headset PCB Manufacturing
NOD Electronics Co., Ltd. was founded in 2010, is a set design, production of high precision PCB manufacturers. The company since its inception, the continuous introduction of the United States, Japan, Germany, Taiwan and other areas of advanced production equipment and production technology, production of high-density and high the reliability of the circuit boards, widely used in headset, computers, digital products, household appliances and LED, such as high-tech fields. Comprehensive products through UL, ISO-9001 quality system certification, the EU SGS certified lead-free products. Products are mainly exported to mainland China, Hong Kong, Taiwan, Southeast Asia and Europe and the United States and other countries.
Our Capabilities of Headset PCB Manufacturing
Total Pad Size Standard Advanced Capture Pad Drill + 0.008 Drill + 0.006 Landing Pad Drill + 0.008 Drill + 0.006 BC Mechanical Drill (Type III) 0.008 0.006 Laser Drill Size 0.004-0.010 0.0025 Material Thickness 0.0035 0.0025 Stacked Via Yes Yes Type I Capabilities single & Double Deep Yes Yes Type II Capabilities Buried Vias with Microvias Yes Yes Type III Capabilities Yes Yes Copper Filled Microvia Yes Yes Smallest Copper Filled Microvia 0.004 0.0025 Copper Filled Microvia Aspect Ratio 0.75:1 1:1 Smallest Laser Microvia Hole Size 0.004 0.0025 Laser Via Aspect Ratio (Depth:Diameter) 0.75:1 1:1
Costs and Quotation of Headset PCB Manufacturing
The total costs of headset PCB manufacturing and assembly services are mainly determined by PCB dimension, laminate thickness, surface finish, layer(s), other special technical requirements (such as blind & buried via, impedance), components, numbers of soldering pads and test plan. You can send PCB files (Gerbers) and BOM to get instant quotation within 24 hours.
With our extensive ISO accreditations and in-house IPC training program we have a proven track record and commitment to delivering quality products and services.